SEMICONDUCTOR DEVICE
To provide a semiconductor device capable of surely suppressing a die bonding member from creeping up on a side surface of a semiconductor chip.SOLUTION: A semiconductor device 1 comprises an insulation substrate 10 and a semiconductor element 21. The insulation substrate 10 comprises a circuit patt...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | To provide a semiconductor device capable of surely suppressing a die bonding member from creeping up on a side surface of a semiconductor chip.SOLUTION: A semiconductor device 1 comprises an insulation substrate 10 and a semiconductor element 21. The insulation substrate 10 comprises a circuit pattern 12. The semiconductor element 21 is joined onto the circuit pattern 12 of the insulation substrate 10 by a conductive adhesive 30. At least a part of a side surface of the semiconductor element 21 is covered by a coating material 24 having a lower adhesive force to the conductive adhesive 30 than an epoxy resin.SELECTED DRAWING: Figure 2
【課題】ダイボンディングの部材が半導体チップの側面上を這い上がることをより確実に抑制可能な半導体装置を提供する。【解決手段】半導体装置１は、絶縁基板１０と、半導体素子２１とを備える。絶縁基板１０は回路パターン１２を有する。半導体素子２１は絶縁基板１０の回路パターン１２上に導電性接着剤３０により接合される。半導体素子２１の側面の少なくとも一部は、エポキシ樹脂よりも導電性接着剤３０に対する接着力が低い被覆材料２４により覆われている。【選択図】図２ |
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