METHOD FOR PREDICTING DEGRADATION OF GREASE, GREASE, AND METHOD FOR MANUFACTURING GREASE

To provide a method for predicting a degradation of a grease applied between a semiconductor module containing a semiconductor element and a cooling unit.SOLUTION: The method for predicting a degradation of a grease uses the restoration rate G1/G2, which is obtained by dividing the storage elastic m...

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Hauptverfasser:	UCHIYAMA KAZUNORI, HAKAMADA NAOKI, SASAKI TADASHI, YOSHIDA TADASHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS SEMICONDUCTOR DEVICES TESTING THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a method for predicting a degradation of a grease applied between a semiconductor module containing a semiconductor element and a cooling unit.SOLUTION: The method for predicting a degradation of a grease uses the restoration rate G1/G2, which is obtained by dividing the storage elastic modulus G1 of the grease at the highest usage temperature to be applied to a semiconductor element by the loss elastic modulus G2, and a strain of the grease when the storage elastic modulus G1 and the loss elastic modulus G2 are the same. The restoration rate and the strain of the grease are used as parameters so that the degradation of the grease can be precisely predicted.SELECTED DRAWING: Figure 5 【課題】半導体素子を収容した半導体モジュールと冷却器の間に塗布されるグリスの劣化を予測する方法を提供する。【解決手段】グリスの劣化の予測方法は、半導体素子の予定される最高使用温度におけるグリスの貯蔵弾性率Ｇ１を損失弾性率Ｇ２で除した復元率Ｇ１／Ｇ２と、貯蔵弾性率Ｇ１と損失弾性率Ｇ２が同じ値となるときのグリスの歪みと、を用いる。復元率と、グリスの歪みをパラメータとすることにより、グリスの劣化を精度良く予測することができる。【選択図】図５