COMPOSITION FOR ELECTROLESS PLATING, CURED PRODUCT FOR ELECTROLESS PLATING, METHOD FOR PRODUCING CURED PRODUCT FOR ELECTROLESS PLATING, WIRING BOARD, AND METHOD FOR PRODUCING WIRING BOARD

To provide a composition for electroless plating that ensures excellent metal deposition by electroless plating and can form a cured film for electroless plating having excellent surface smoothness.SOLUTION: A composition for electroless plating contains (1) a copolymer containing a (meth) acrylate...

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Hauptverfasser:	OTOMO CHIAKI, SUZUKI TAKUMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	To provide a composition for electroless plating that ensures excellent metal deposition by electroless plating and can form a cured film for electroless plating having excellent surface smoothness.SOLUTION: A composition for electroless plating contains (1) a copolymer containing a (meth) acrylate monomer unit having an amino group, a (meth) acrylate monomer unit having a hydroxy group, and a (meth) acrylate monomer unit having a protected carboxy group, and (2) a solvent.SELECTED DRAWING: None 【課題】無電解メッキによる金属の析出性に優れ、表面の平滑性に優れた無電解メッキ用硬化膜を形成可能な無電解メッキ用組成物を提供する。【解決手段】（１）アミノ基を有する（メタ）アクリレート系単量体単位と、水酸基を有する（メタ）アクリレート系単量体単位と、保護されたカルボキシ基を有する（メタ）アクリレート系単量体単位とを有する共重合体と、（２）溶剤とを含有する、無電解メッキ用組成物。【選択図】なし