PACKAGE FOR MICROWAVE PROCESSING
To provide a package for microwave processing capable of discharging vapor by creating a vent in an overlap film during microwave processing and easily removing the overlap film after the microwave processing.SOLUTION: A package 1 for microwave processing includes: an object 2 that can be heated by...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a package for microwave processing capable of discharging vapor by creating a vent in an overlap film during microwave processing and easily removing the overlap film after the microwave processing.SOLUTION: A package 1 for microwave processing includes: an object 2 that can be heated by microwaves; a container 3, in which the object 2 is placed, having a lower wall surface portion 31 and a side wall surface portion 32; and an overlap film 4 that encapsulates the entire container 3 in a tightly-sealed state and is heat-shrink mounted on the container 3. The overlap film 4 is provided with a heat generating unit 5 that generates heat by absorbing microwaves at a position corresponding to the side wall surface portion 32.SELECTED DRAWING: Figure 1
【課題】 マイクロ波処理時にオーバーラップフィルムに通気部を生じさせて蒸気を排出でき、マイクロ波処理後にオーバーラップフィルムを容易に除去できるマイクロ波処理用包装体を提供する。【解決手段】 マイクロ波処理用包装体1は、マイクロ波により加熱可能な対象物2と、前記対象物2が入れられ且つ下壁面部31及び側壁面部32を有する容器3と、前記容器3の全体を密封状に被包し且つ前記容器3に熱収縮装着されたオーバーラップフィルム4と、を有し、前記オーバーラップフィルム4には、前記側壁面部32に対応する位置に、マイクロ波を吸収して発熱する発熱部5が設けられている。【選択図】 図1 |
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