SUBSTRATE PROCESSING APPARATUS

To execute substrate processing with substrate warpage suppressed.SOLUTION: A hydrophobizing unit U5 includes a hot plate 21c on which a wafer W to be processed is placed, a suction unit 70 that applies a suction force to the back surface of the wafer W through a plurality of first through holes 211...

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Bibliographische Detailangaben
Hauptverfasser:	USHIMARU KOJI, ITONAGA SHOJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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