NON-CONTACT SLIP RING DEVICE

To solve a problem in which, conventionally, in a circuit (slip ring) that transmits power between two moving subsystems, a slider is taken out from one of the subsystems and mechanically contacted with an electrode on the other subsystem's surface to transmit current, and in this case, since t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIONO MITSUHIRO, TAKANO TADASHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To solve a problem in which, conventionally, in a circuit (slip ring) that transmits power between two moving subsystems, a slider is taken out from one of the subsystems and mechanically contacted with an electrode on the other subsystem's surface to transmit current, and in this case, since the surfaces of two conductors that come into contact with each other are scraped, scraps accumulate on the surface, and therefore, maintenance work is necessary, and the maintenance is difficult depending on the application.SOLUTION: Two capacitors are formed side by side in the longitudinal direction, and two subsystems are electrically coupled by the capacitors by forming electrodes on the outer surface of an inner core and the inner surface of an outer core for the two subsystems that are long in the direction of the rotation axis. In addition, the capacitor is resonated, and obstruction to power transmission is eliminated by adding inductance corresponding to a connection line connected to a power source and a load. As a result, an apparatus for efficiently transmitting power between the subsystems without contact is obtained.SELECTED DRAWING: Figure 4 【課題】 従来二つの動くサブシステム間で電力を伝送する回路(スリップリング)では、一方のサブシステムから摺動子を出し他方のサブシステム表面の電極に機械的に接触して、電流を流すことにより伝送していた。この場合、接触する2導体の表面が削れるため、屑が表面に蓄積してしまう。そのため保守作業が必要であり、適用によっては保守が難しいという弊害が有った。【解決手段】 回転軸方向に長い2サブシステムに対し、中子の外表面と外子の内表面上に各々電極を形成することによって、2容量を長手方向に並べて形成し、該容量により2サブシステムを電気的に結合する。かつ電源や負荷と結ぶ接続線に対応してインダクタンスを付加することによって、該容量を共振させ、電力伝送への阻害を無くす。その結果サブシステム間で、無接触で効率よく電力を伝送する装置を得る。【選択図】図4