SUSPENSION BOARD AGGREGATION WITH CIRCUIT AND MANUFACTURING METHOD FOR SUSPENSION BOARD AGGREGATION WITH CIRCUIT

To provide a suspension board aggregation with a circuit capable of restraining warpage, and to provide a manufacturing method for the suspension board aggregation with the circuit.SOLUTION: A suspension board aggregation with a circuit includes multiple suspension boards 2 with the circuit placed on an aggregation sheet 1 while being spaced apart from each other, and a frame body 3 surrounding the multiple suspension boards 2 with the circuit collectively. The frame body 3 includes two horizontal frames 4 placed at both sides in a longitudinal direction for the multiple suspension boards 2 with the circuit, and supporting the multiple suspension boards 2 with the circuit collectively and continuously to the multiple suspension boards 2 with the circuit, respectively. The two horizontal frames 4 include a first metal frame body 18, and a strengthening conductor layer 19 placed at one side of the first metal frame body 18 in a thickness direction, respectively. The strengthening conductor layer 19 is formed to overlap with at least the suspension boards 2 with the circuit adjoining each other, out of the multiple suspension boards 2, when projecting in the longitudinal direction.SELECTED DRAWING: Figure 1 【課題】反りを抑制できる回路付サスペンション基板集合体および回路付サスペンション基板集合体の製造方法を提供すること。【解決手段】集合体シート１に、互いに間隔を空けて配置される複数の回路付サスペンション基板２と、複数の回路付サスペンション基板２を一括して囲む枠体３とを備える。枠体３に、複数の回路付サスペンション基板２に対して長手方向の両側に配置され、複数の回路付サスペンション基板２のそれぞれと連続して、複数の回路付サスペンション基板２を一括して支持する２つの横枠４を備える。２つの横枠４の両方に、第１金属枠体１８と、第１金属枠体１８の厚み方向の一方側に配置される補強導体層１９とを備える。補強導体層１９を、長手方向に投影したときに、複数の回路付サスペンション基板２のうち、少なくとも互いに隣り合う回路付サスペンション基板２と重なるように形成する。【選択図】図１