PLATE-LIKE MEMBER, AND HEAT EXCHANGER FORMED BY USING PLATE-LIKE MEMBER

To provide a plate-like member capable of preventing decline of adhesion of a coating for covering the surface; and to provide a heat exchanger formed by using the plate-like member.SOLUTION: A plate-like member 20 includes a substrate 210, and resin films (230, 240) formed so as to cover the surfac...

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Bibliographische Detailangaben
1. Verfasser:	KAFUKU KAZUAKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BLASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION DIFFUSION TREATMENT OF METALLIC MATERIAL HEAT EXCHANGE IN GENERAL HEATING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIGHTING MECHANICAL ENGINEERING METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION WEAPONS
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Beschreibung
Zusammenfassung:	To provide a plate-like member capable of preventing decline of adhesion of a coating for covering the surface; and to provide a heat exchanger formed by using the plate-like member.SOLUTION: A plate-like member 20 includes a substrate 210, and resin films (230, 240) formed so as to cover the surface of the substrate 210. A moisture prevention film 220 for preventing moisture passing through the resin films (230, 240) from reaching the surface of the substrate 210 is formed between the surface of the substrate 210 and the resin films (230, 240).SELECTED DRAWING: Figure 2 【課題】表面を覆う被膜の密着性が低下してしまうことを防止することのできる板状部材、及び当該板状部材を用いて形成された熱交換器を提供する。【解決手段】板状部材２０は、基材２１０と、基材２１０の表面を覆うように形成された樹脂被膜（２３０，２４０）と、を備える。基材２１０の表面と樹脂被膜（２３０，２４０）との間には、樹脂被膜（２３０，２４０）を通過した水分が基材２１０の表面に到達することを防止するための水分防止膜２２０が形成されている【選択図】図２