POLISHING HEAD, CMP POLISHING DEVICE HAVING POLISHING HEAD, AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT USING THE SAME

To provide a polishing head of a CMP polishing device which is improved in polishing uniformity.SOLUTION: A polishing head of a CMP polishing device includes: a polishing pad; a first air bag 201 and a second air bag 202 which abut on the backside of a wafer placed on the surface of a polishing pad...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAMAMOTO SUKEHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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