POLISHING HEAD, CMP POLISHING DEVICE HAVING POLISHING HEAD, AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT USING THE SAME

To provide a polishing head of a CMP polishing device which is improved in polishing uniformity.SOLUTION: A polishing head of a CMP polishing device includes: a polishing pad; a first air bag 201 and a second air bag 202 which abut on the backside of a wafer placed on the surface of a polishing pad...

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Bibliographische Detailangaben
1. Verfasser:	YAMAMOTO SUKEHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	To provide a polishing head of a CMP polishing device which is improved in polishing uniformity.SOLUTION: A polishing head of a CMP polishing device includes: a polishing pad; a first air bag 201 and a second air bag 202 which abut on the backside of a wafer placed on the surface of a polishing pad and press the wafer surface against the polishing pad; and a top ring surrounding the air bag and the wafer. The first air bag abutting on a center part of the wafer and the second air bag abutting on an outer peripheral part of the wafer are bag bodies different from each other and a first film thickness of the first air bag is thicker than a second film thickness of the second air bag.SELECTED DRAWING: Figure 2 【課題】研磨均一性が向上するＣＭＰ研磨装置の研磨ヘッドを提供する。【解決手段】ＣＭＰ研磨装置の研磨ヘッドは、研磨パッドと、研磨パッドの表面に載置されたウェハの裏面に当接し、ウェハの表面を研磨パッドに押し付ける第１エアーバッグ２０１および第２エアーバッグ２０２と、エアーバッグおよびウェハとを囲うトップリングと、を備える。ウェハの中心部に当接する第１エアーバッグと、ウェハの外周部に当接する第２エアーバッグとは異なる袋体であり、第１エアーバッグの第１膜厚よりも第２エアーバッグの第２膜厚が厚い。【選択図】図２