POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME

To provide a thermoplastic resin composition which is excellent in mechanical strength and metal bonding strength and has both a low dielectric constant and a low dielectric loss tangent.SOLUTION: The thermoplastic resin composition is obtained by blending 100 pts.wt. of the total of (A) 24-85 pts.w...

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Bibliographische Detailangaben
Hauptverfasser: SHIROTANI KOSUKE, MAEDA YASUO
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a thermoplastic resin composition which is excellent in mechanical strength and metal bonding strength and has both a low dielectric constant and a low dielectric loss tangent.SOLUTION: The thermoplastic resin composition is obtained by blending 100 pts.wt. of the total of (A) 24-85 pts.wt. of a polyalkylene terephthalate resin, (B) 1.0-9.0 pts.wt. of a glycidyl group-containing copolymer containing an α-olefin and a glycidyl ester of an α,β-unsaturated acid, (C) 1.0-9.0 pts.wt. of a copolymer obtained by copolymerizing ethylene and a C3 or higher α-olefin, (D) 3.0-18 pts.wt. of a cyclic olefin resin, and (E) 10-40 pts.wt. of glass fibers.SELECTED DRAWING: None 【課題】機械強度、金属接合強度に優れ、かつ低い比誘電率および誘電正接を兼ね備えた熱可塑性樹脂組成物を提供する。【解決手段】(A)ポリアルキレンテレフタレート系樹脂24〜85重量部、(B)α−オレフィンとα,β−不飽和酸のグリシジルエステルを含むグリシジル基含有共重合体1.0〜9.0重量部、(C)エチレンと炭素数3以上のα−オレフィンを共重合してなる共重合体1.0〜9.0重量部、(D)環状オレフィン系樹脂3.0〜18重量部、および(E)ガラス繊維10〜40重量部の合計100重量部を配合してなる熱可塑性樹脂組成物。【選択図】なし