SINGLE-SIDE POLISHING METHOD OF WAFER

To provide a single-side polishing method of wafer capable of obtaining a wafer having desired ESFQD with high accuracy.SOLUTION: A polishing method of a wafer includes a first step (step S10) of calculating ejection amount of the wafer (=center thickness of wafer-thickness of retainer ring), a seco...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOSASA KAZUAKI, SUGIMORI KATSUHISA, SATO YOZO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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