PRINTED CIRCUIT BOARD

To provide a printed circuit board capable of suppressing the occurrence of soldering defects in solder for joining adjacent electrodes.SOLUTION: A printed circuit board 1 includes an insulating substrate 6 in which a mounting hole 15 having a larger width in the second direction perpendicular to the first direction than the width in the first direction is formed, an insulating substrate 18 having a connecting portion 23a that protrudes from the surface 6b through the mounting hole 15, electrodes 7 and 9 provided on the surface 6b and arranged at the edge along the second direction of the mounting hole 15, and electrodes 19 and 25 provided in the connection portion 23a and joined to the electrodes 7 and 9 by soldering. The width of the electrodes 19 and 25 in the second direction is smaller than the width of the electrodes 7 and 9 in the second direction.SELECTED DRAWING: Figure 7 【課題】隣接する電極同士を接合するはんだにおけるはんだ付け不良の発生を抑制できるプリント回路板を提供する。【解決手段】プリント回路板１は、第１方向の幅より第１方向と直交する第２方向の幅の方が大きい取付孔１５が形成された絶縁基板６と、取付孔１５を貫通して表面６ｂから突出する接続部２３ａを有する絶縁基板１８と、表面６ｂに設けられ、取付孔１５の第２方向に沿った縁部に配置された電極７、９と、接続部２３ａに設けられ、はんだによって電極７、９に接合された電極１９、２５と、を備える。そして、電極１９、２５の第２方向の幅は、電極７、９の第２方向の幅より小さい。【選択図】図７