METHOD FOR MANUFACTURING WAFER

To provide a method for manufacturing a wafer including smoothing a surface of a wafer with a resist material.SOLUTION: A method for manufacturing a wafer is a method for forming a resist film, by a spin coating method, on a hollow wafer formed with a cavity therein and formed with a communication h...

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Bibliographische Detailangaben
1. Verfasser:	HISHINUMA KUNIYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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