FILM DEPOSITION APPARATUS FOR METALLIC FILM

To provide a film deposition apparatus capable of easily avoiding formation of a metallic film with reduced gloss.SOLUTION: The film deposition apparatus for forming the metallic film on a surface of a substrate by reducing metal ions derived from an anode on a substrate according to one aspect of the embodiment comprises at least: a solution chamber that is placed between the anode and a solid electrolyte membrane and stores a metal solution; pressing means for relatively pressing the anode and the substrate to bring the substrate and the solid electrolyte membrane into contact with each other; and a power supply unit that applies voltage between the anode and the substrate. The film deposition apparatus has a voltage measurement unit for measuring an immersion potential Vbetween the anode and the substrate when the substrate and the solid electrolyte membrane are brought into contact with each other, and a maximum electrolytic reaction potential Vbetween the anode and the substrate when a constant current is applied, and a control unit that determines whether the potential difference (V-V) between the maximum electrolytic reaction potential Vand the immersion potential Vis equal to or greater than a predetermined set value.SELECTED DRAWING: Figure 1 【課題】本開示の目的は、光沢が低下した金属皮膜の形成を容易に回避できる成膜装置を提供することである。【解決手段】本実施形態の一態様は、陽極と固体電解質膜との間に配置され、金属溶液を収容する溶液室と、前記陽極と前記基材とを相対的に押圧して前記基材と前記固体電解質膜とを接触させる押圧手段と、前記陽極及び前記基材の間に電圧を印加する電源部と、を少なくとも備え、前記陽極に由来する金属イオンを前記基板上で還元することで金属皮膜を前記基材の表面に成膜する成膜装置であって、前記基材と前記固体電解質膜とが接触したときの前記陽極と前記基材の間の浸漬電位Ｖ１と、定電流を通電したときの前記陽極と前記基材の間の最大電解反応電位Ｖ２とを測定する電圧測定部と、前記最大電解反応電位Ｖ２と前記浸漬電位Ｖ１との電位差（Ｖ２−Ｖ１）が所定の設定値以上であるかどうかを判断する制御部と、を備える、成膜装置である。【選択図】図１