SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing method and a substrate processing apparatus that shorten a replenishment time of a processing solution.SOLUTION: A substrate processing method according to an embodiment that executes etching processing by immersing a substrate in a processing solution containing a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: TAKAYAMA KAZUYA
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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