SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

To provide a substrate processing method and a substrate processing apparatus that shorten a replenishment time of a processing solution.SOLUTION: A substrate processing method according to an embodiment that executes etching processing by immersing a substrate in a processing solution containing a chemical solution and silicon and includes a preparation step and a replenishment step. In the preparation step, the chemical solution supply rate is set on the basis of the chemical solution replenishment amount and the silicon replenishment amount. In the replenishment step, the chemical solution is supplied at a set supply rate, and the silicon of the set replenishment amount is dissolved in the processing solution.SELECTED DRAWING: Figure 2 【課題】処理液の補充時間を短くする基板処理方法および基板処理装置を提供する。【解決手段】実施形態に係る基板処理方法は、薬液とシリコンとを含む処理液に基板を浸漬させてエッチング処理を行い、準備工程と、補充工程とを含む。準備工程は、薬液の補充量とシリコンの補充量とに基づいて薬液の供給速度を設定する。補充工程は、設定された供給速度で薬液を供給するとともに、設定された補充量のシリコンを処理液に溶解させる。【選択図】図２