MULTILAYER WIRING STRUCTURE AND MANUFACTURING METHOD THEREOF

SOLUTION: A wiring structure comprises a multilayer wiring structure in which a plurality of wiring layers are stacked and a plurality of bumps 126 disposed above the multilayer wiring structure and electrically connected to any one of the plurality of wiring layers. The top of at least one of the b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIGIRA ATSUKO, TAWARAYA SEIJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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