ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM, COVER LAY, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD
To provide an adhesive composition for printed wiring board excellent in heat resistance.SOLUTION: An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an Mw of 25,000-150,000, an epoxy resin, and an inorgan...
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| creator | UCHIDA YOSHIFUMI KAKIMOTO MASAYA SUGAWARA JUN KAIMORI SHINGO ASAI SHOGO YONEZAWA TAKAYUKI |
| description | To provide an adhesive composition for printed wiring board excellent in heat resistance.SOLUTION: An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an Mw of 25,000-150,000, an epoxy resin, and an inorganic filler.SELECTED DRAWING: None
【課題】耐熱性に優れるプリント配線板用接着剤組成物の提供。【解決手段】式（１）（２）で表されるＭｗが２．５〜１５万のシロキサン変性ポリイミドと、エポキシ樹脂と、無機フィラーを配合したプリント配線板用接着剤組成物。【選択図】なし |
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【課題】耐熱性に優れるプリント配線板用接着剤組成物の提供。【解決手段】式（１）（２）で表されるＭｗが２．５〜１５万のシロキサン変性ポリイミドと、エポキシ樹脂と、無機フィラーを配合したプリント配線板用接着剤組成物。【選択図】なし</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190718&DB=EPODOC&CC=JP&NR=2019116619A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190718&DB=EPODOC&CC=JP&NR=2019116619A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UCHIDA YOSHIFUMI</creatorcontrib><creatorcontrib>KAKIMOTO MASAYA</creatorcontrib><creatorcontrib>SUGAWARA JUN</creatorcontrib><creatorcontrib>KAIMORI SHINGO</creatorcontrib><creatorcontrib>ASAI SHOGO</creatorcontrib><creatorcontrib>YONEZAWA TAKAYUKI</creatorcontrib><title>ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM, COVER LAY, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD</title><description>To provide an adhesive composition for printed wiring board excellent in heat resistance.SOLUTION: An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an Mw of 25,000-150,000, an epoxy resin, and an inorganic filler.SELECTED DRAWING: None
【課題】耐熱性に優れるプリント配線板用接着剤組成物の提供。【解決手段】式（１）（２）で表されるＭｗが２．５〜１５万のシロキサン変性ポリイミドと、エポキシ樹脂と、無機フィラーを配合したプリント配線板用接着剤組成物。【選択図】なし</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZKh1dPFwDfYMc1Vw9vcN8A_2DPH091Nw8w9SCAjy9AtxdVEI9wQy3BWc_B2DXHSAlJ8LiOvm6eOrA9QT5hqk4OMYCWIGBLgG6Tr7OLoABXw9_RxBmgN8gJSOgqOfC1bzeBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvFeAkYGhpaGhmZmhpaMxUYoA2pY7IA</recordid><startdate>20190718</startdate><enddate>20190718</enddate><creator>UCHIDA YOSHIFUMI</creator><creator>KAKIMOTO MASAYA</creator><creator>SUGAWARA JUN</creator><creator>KAIMORI SHINGO</creator><creator>ASAI SHOGO</creator><creator>YONEZAWA TAKAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20190718</creationdate><title>ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM, COVER LAY, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD</title><author>UCHIDA YOSHIFUMI ; KAKIMOTO MASAYA ; SUGAWARA JUN ; KAIMORI SHINGO ; ASAI SHOGO ; YONEZAWA TAKAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019116619A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>UCHIDA YOSHIFUMI</creatorcontrib><creatorcontrib>KAKIMOTO MASAYA</creatorcontrib><creatorcontrib>SUGAWARA JUN</creatorcontrib><creatorcontrib>KAIMORI SHINGO</creatorcontrib><creatorcontrib>ASAI SHOGO</creatorcontrib><creatorcontrib>YONEZAWA TAKAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UCHIDA YOSHIFUMI</au><au>KAKIMOTO MASAYA</au><au>SUGAWARA JUN</au><au>KAIMORI SHINGO</au><au>ASAI SHOGO</au><au>YONEZAWA TAKAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM, COVER LAY, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD</title><date>2019-07-18</date><risdate>2019</risdate><abstract>To provide an adhesive composition for printed wiring board excellent in heat resistance.SOLUTION: An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an Mw of 25,000-150,000, an epoxy resin, and an inorganic filler.SELECTED DRAWING: None
【課題】耐熱性に優れるプリント配線板用接着剤組成物の提供。【解決手段】式（１）（２）で表されるＭｗが２．５〜１５万のシロキサン変性ポリイミドと、エポキシ樹脂と、無機フィラーを配合したプリント配線板用接着剤組成物。【選択図】なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM, COVER LAY, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD |
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