ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, BONDING FILM, COVER LAY, COPPER-CLAD LAMINATED PLATE, AND PRINTED WIRING BOARD

To provide an adhesive composition for printed wiring board excellent in heat resistance.SOLUTION: An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an Mw of 25,000-150,000, an epoxy resin, and an inorgan...

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Bibliographische Detailangaben
Hauptverfasser:	UCHIDA YOSHIFUMI, KAKIMOTO MASAYA, SUGAWARA JUN, KAIMORI SHINGO, ASAI SHOGO, YONEZAWA TAKAYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide an adhesive composition for printed wiring board excellent in heat resistance.SOLUTION: An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an Mw of 25,000-150,000, an epoxy resin, and an inorganic filler.SELECTED DRAWING: None 【課題】耐熱性に優れるプリント配線板用接着剤組成物の提供。【解決手段】式（１）（２）で表されるＭｗが２．５〜１５万のシロキサン変性ポリイミドと、エポキシ樹脂と、無機フィラーを配合したプリント配線板用接着剤組成物。【選択図】なし