RESIN MULTILAYER SUBSTRATE

To provide resin multilayer substrates, for each of which the non-joined state between resin layers is eliminated in a portion that tends to be subjected to an insufficient action of heat and pressure by pressing in a thermocompression bonding step.SOLUTION: A resin multilayer substrate 101 includes a stacked body 1 including a plurality of resin layers 2 stacked therein, a component 3, one or more first conductor patterns 7, and one or more second conductor patterns 8 each disposed in a gap between the resin layers 2 inside the stacked body 1. At least a portion of an outline of each of the first conductor patterns 7 is in a position that overlaps with the component 3. An outline of each of the second conductor patterns 8 is in a position that does not overlap with the component 3. A resin portion 15 comprising a thermoplastic resin is disposed to be adjacent to the outside of each of the first conductor patterns 7 along a portion of the outline of each of the first conductor patterns 7, the portion overlapping with the component 3. The resin portion 15 is not disposed in a portion along the outline of each of the second conductor patterns 8.SELECTED DRAWING: Figure 1 【課題】熱圧着工程におけるプレスの熱や圧力の作用が不十分となりがちな箇所における樹脂層間の未接合状態を解消した樹脂多層基板を提供する。【解決手段】樹脂多層基板１０１は、複数の樹脂層２を積層したものである積層体１と、部品３と、１以上の第１種導体パターン７と、積層体１の内部で樹脂層２同士の隙間に配置され、１以上の第２種導体パターン８とを備え、第１種導体パターン７の各々の外形線の少なくとも一部は、部品３と重なる位置にあり、第２種導体パターン８の各々の外形線は、部品３と全く重ならない位置にあり、第１種導体パターン７の各々の外形線のうち部品３と重なる部分に沿って、第１種導体パターン７の外側に隣接するように、熱可塑性樹脂から構成される樹脂部１５が配置されており、第２種導体パターン８の各々の外形線に沿う部分には樹脂部１５が配置されていない。【選択図】図１