COIL COMPONENT
To reduce the number of insulating substrates required while preventing contact between coil portions adjacent in the stacking direction.SOLUTION: A coil component includes a coil portion 100 formed on the surface 11 of an insulating substrate 10, a coil portion 200 formed on the surface 12 of the i...
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Zusammenfassung: | To reduce the number of insulating substrates required while preventing contact between coil portions adjacent in the stacking direction.SOLUTION: A coil component includes a coil portion 100 formed on the surface 11 of an insulating substrate 10, a coil portion 200 formed on the surface 12 of the insulating substrate 10, a coil portion 300 formed on the surface 24 of an insulating substrate 20, a coil portion 400 formed on the surface 36 of an insulating substrate 30, connection patterns P11 to P16 formed on the surface 23 of the insulating substrate 20, and connection patterns P21 to P26 formed on the surface 35 of the insulating substrate 30. The inner peripheral end of coil portion 100 and the inner peripheral end of coil portion 200 are connected to each other through connection portions TH11 to TH16 provided so as to penetrate through the insulating substrate 10, and the connection patterns P11 to P16 and the connection patterns P21 to P26 are connected to each other through an opening 10a provided in the insulating substrate 10. Thus, the number of insulating substrates required can be reduced while contact between the coil portions is prevented.SELECTED DRAWING: Figure 1
【課題】積層方向に隣接するコイル部同士の接触を防止しつつ、必要な絶縁基板の数を削減する。【解決手段】絶縁基板10の表面11に形成されたコイル部100と、絶縁基板10の表面12に形成されたコイル部200と、絶縁基板20の表面24に形成されたコイル部300と、絶縁基板30の表面36に形成されたコイル部400と、絶縁基板20の表面23に形成された接続パターンP11〜P16と、絶縁基板30の表面35に形成された接続パターンP21〜P26とを備える。コイル部100の内周端とコイル部200の内周端は、絶縁基板10を貫通して設けられた接続部TH11〜TH16を介して互いに接続され、接続パターンP11〜P16と接続パターンP21〜P26は、絶縁基板10に設けられた開口部10aを介して互いに接続される。これにより、コイル部同士の接触を防止しつつ、必要な絶縁基板の数を削減することができる。【選択図】図1 |
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