CONTROL DEVICE, LASER PROCESSOR, METHOD FOR CONTROLLING LASER PROCESSOR AND PROGRAM

To suppress variation in diameter of holes by boring.SOLUTION: A distance acquisition part acquires distance data indicating a distance measured by a distance meter. A correction value specification part specifies a correction value for correcting a distance between a laser head and a workpiece to a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUMURA AKIHIKO, TAUCHI TAKUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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