CONTROL DEVICE, LASER PROCESSOR, METHOD FOR CONTROLLING LASER PROCESSOR AND PROGRAM

To suppress variation in diameter of holes by boring.SOLUTION: A distance acquisition part acquires distance data indicating a distance measured by a distance meter. A correction value specification part specifies a correction value for correcting a distance between a laser head and a workpiece to a...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMURA AKIHIKO, TAUCHI TAKUJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	To suppress variation in diameter of holes by boring.SOLUTION: A distance acquisition part acquires distance data indicating a distance measured by a distance meter. A correction value specification part specifies a correction value for correcting a distance between a laser head and a workpiece to a target distance based on the distance data. A correction part corrects a relative position of the laser head to the workpiece based on the correction value.SELECTED DRAWING: Figure 1 【課題】穴明け加工による穴の直径のばらつきを抑える【解決手段】距離取得部は、距離計が計測した距離を示す距離データを取得する。補正値特定部は、距離データに基づいてレーザヘッドと被加工物との距離を目的距離にするための補正値を特定する。補正部は、補正値に基づいてレーザヘッドと被加工物との相対位置を補正する。【選択図】図１