METHOD OF MODIFYING DEFORMATION OF SUBSTRATE, AND DEVICE
To provide a method of modifying deformation of a substrate, and a device.SOLUTION: A substrate support body 500 includes: a base part 502 having an inner part region formed by a wall 506 extended to an upper direction from the base part; a plurality of infrared lamps 507 arranged in the inner part...
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| creator | SU JUN-LIANG KARTHIK ELUMALAI ARUNKUMAR M TATTI DIMANTHA RAJAPAKSA SRISKANTHARAJAH THIRUNAVUKARASU PEH ENG SHENG SHOJU VAYYAPRON |
| description | To provide a method of modifying deformation of a substrate, and a device.SOLUTION: A substrate support body 500 includes: a base part 502 having an inner part region formed by a wall 506 extended to an upper direction from the base part; a plurality of infrared lamps 507 arranged in the inner part region; a support plate 508 arranged onto the plurality of infrared lamps, and containing a support surface 512 supporting the substrate; a center opening part 514 arranged onto the support plate and corresponded to the support surface; and an exhaust part 516 in the circumference of a top surface of a cover plate. The exhaust part includes a cover plates 510 having a plurality of punchings 522 fluid-connecting a space on the cover plate with an exhaust pipe formed to the cover plate.SELECTED DRAWING: Figure 5
【課題】基板の変形を修正するための方法及び装置を提供する。【解決手段】基板支持体５００は、基部５０２から上向きに延びている壁５０６によって形成された内部領域を有する基部と、内部領域内に配置された複数の赤外線ランプ５０７と、複数の赤外線ランプの上に配置されて、基板を支持する支持面５１２を含む支持プレート５０８と、支持プレートの上に配置されて、支持面に対応する中心開口部５１４と、カバープレートの頂面の周囲に排気部５１６とを有し、排気部はカバープレートの上の空間とカバープレートに形成された排気導管とを流体連結させる複数の穿孔５２２を有するカバープレート５１０と、を含む。【選択図】図５ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2019110290A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2019110290A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2019110290A3</originalsourceid><addsrcrecordid>eNrjZLDwdQ3x8HdR8HdT8PV38XSL9PRzV3BxdfMP8nUM8fT3A0kEhzoFhwQ5hrjqKDj6uQBlwzydXXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoaWhoYGRpYGjMVGKAJgjKJo</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MODIFYING DEFORMATION OF SUBSTRATE, AND DEVICE</title><source>esp@cenet</source><creator>SU JUN-LIANG ; KARTHIK ELUMALAI ; ARUNKUMAR M TATTI ; DIMANTHA RAJAPAKSA ; SRISKANTHARAJAH THIRUNAVUKARASU ; PEH ENG SHENG ; SHOJU VAYYAPRON</creator><creatorcontrib>SU JUN-LIANG ; KARTHIK ELUMALAI ; ARUNKUMAR M TATTI ; DIMANTHA RAJAPAKSA ; SRISKANTHARAJAH THIRUNAVUKARASU ; PEH ENG SHENG ; SHOJU VAYYAPRON</creatorcontrib><description>To provide a method of modifying deformation of a substrate, and a device.SOLUTION: A substrate support body 500 includes: a base part 502 having an inner part region formed by a wall 506 extended to an upper direction from the base part; a plurality of infrared lamps 507 arranged in the inner part region; a support plate 508 arranged onto the plurality of infrared lamps, and containing a support surface 512 supporting the substrate; a center opening part 514 arranged onto the support plate and corresponded to the support surface; and an exhaust part 516 in the circumference of a top surface of a cover plate. The exhaust part includes a cover plates 510 having a plurality of punchings 522 fluid-connecting a space on the cover plate with an exhaust pipe formed to the cover plate.SELECTED DRAWING: Figure 5
【課題】基板の変形を修正するための方法及び装置を提供する。【解決手段】基板支持体５００は、基部５０２から上向きに延びている壁５０６によって形成された内部領域を有する基部と、内部領域内に配置された複数の赤外線ランプ５０７と、複数の赤外線ランプの上に配置されて、基板を支持する支持面５１２を含む支持プレート５０８と、支持プレートの上に配置されて、支持面に対応する中心開口部５１４と、カバープレートの頂面の周囲に排気部５１６とを有し、排気部はカバープレートの上の空間とカバープレートに形成された排気導管とを流体連結させる複数の穿孔５２２を有するカバープレート５１０と、を含む。【選択図】図５</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190704&DB=EPODOC&CC=JP&NR=2019110290A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190704&DB=EPODOC&CC=JP&NR=2019110290A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SU JUN-LIANG</creatorcontrib><creatorcontrib>KARTHIK ELUMALAI</creatorcontrib><creatorcontrib>ARUNKUMAR M TATTI</creatorcontrib><creatorcontrib>DIMANTHA RAJAPAKSA</creatorcontrib><creatorcontrib>SRISKANTHARAJAH THIRUNAVUKARASU</creatorcontrib><creatorcontrib>PEH ENG SHENG</creatorcontrib><creatorcontrib>SHOJU VAYYAPRON</creatorcontrib><title>METHOD OF MODIFYING DEFORMATION OF SUBSTRATE, AND DEVICE</title><description>To provide a method of modifying deformation of a substrate, and a device.SOLUTION: A substrate support body 500 includes: a base part 502 having an inner part region formed by a wall 506 extended to an upper direction from the base part; a plurality of infrared lamps 507 arranged in the inner part region; a support plate 508 arranged onto the plurality of infrared lamps, and containing a support surface 512 supporting the substrate; a center opening part 514 arranged onto the support plate and corresponded to the support surface; and an exhaust part 516 in the circumference of a top surface of a cover plate. The exhaust part includes a cover plates 510 having a plurality of punchings 522 fluid-connecting a space on the cover plate with an exhaust pipe formed to the cover plate.SELECTED DRAWING: Figure 5
【課題】基板の変形を修正するための方法及び装置を提供する。【解決手段】基板支持体５００は、基部５０２から上向きに延びている壁５０６によって形成された内部領域を有する基部と、内部領域内に配置された複数の赤外線ランプ５０７と、複数の赤外線ランプの上に配置されて、基板を支持する支持面５１２を含む支持プレート５０８と、支持プレートの上に配置されて、支持面に対応する中心開口部５１４と、カバープレートの頂面の周囲に排気部５１６とを有し、排気部はカバープレートの上の空間とカバープレートに形成された排気導管とを流体連結させる複数の穿孔５２２を有するカバープレート５１０と、を含む。【選択図】図５</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwdQ3x8HdR8HdT8PV38XSL9PRzV3BxdfMP8nUM8fT3A0kEhzoFhwQ5hrjqKDj6uQBlwzydXXkYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbxXgJGBoaWhoYGRpYGjMVGKAJgjKJo</recordid><startdate>20190704</startdate><enddate>20190704</enddate><creator>SU JUN-LIANG</creator><creator>KARTHIK ELUMALAI</creator><creator>ARUNKUMAR M TATTI</creator><creator>DIMANTHA RAJAPAKSA</creator><creator>SRISKANTHARAJAH THIRUNAVUKARASU</creator><creator>PEH ENG SHENG</creator><creator>SHOJU VAYYAPRON</creator><scope>EVB</scope></search><sort><creationdate>20190704</creationdate><title>METHOD OF MODIFYING DEFORMATION OF SUBSTRATE, AND DEVICE</title><author>SU JUN-LIANG ; KARTHIK ELUMALAI ; ARUNKUMAR M TATTI ; DIMANTHA RAJAPAKSA ; SRISKANTHARAJAH THIRUNAVUKARASU ; PEH ENG SHENG ; SHOJU VAYYAPRON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019110290A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SU JUN-LIANG</creatorcontrib><creatorcontrib>KARTHIK ELUMALAI</creatorcontrib><creatorcontrib>ARUNKUMAR M TATTI</creatorcontrib><creatorcontrib>DIMANTHA RAJAPAKSA</creatorcontrib><creatorcontrib>SRISKANTHARAJAH THIRUNAVUKARASU</creatorcontrib><creatorcontrib>PEH ENG SHENG</creatorcontrib><creatorcontrib>SHOJU VAYYAPRON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SU JUN-LIANG</au><au>KARTHIK ELUMALAI</au><au>ARUNKUMAR M TATTI</au><au>DIMANTHA RAJAPAKSA</au><au>SRISKANTHARAJAH THIRUNAVUKARASU</au><au>PEH ENG SHENG</au><au>SHOJU VAYYAPRON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MODIFYING DEFORMATION OF SUBSTRATE, AND DEVICE</title><date>2019-07-04</date><risdate>2019</risdate><abstract>To provide a method of modifying deformation of a substrate, and a device.SOLUTION: A substrate support body 500 includes: a base part 502 having an inner part region formed by a wall 506 extended to an upper direction from the base part; a plurality of infrared lamps 507 arranged in the inner part region; a support plate 508 arranged onto the plurality of infrared lamps, and containing a support surface 512 supporting the substrate; a center opening part 514 arranged onto the support plate and corresponded to the support surface; and an exhaust part 516 in the circumference of a top surface of a cover plate. The exhaust part includes a cover plates 510 having a plurality of punchings 522 fluid-connecting a space on the cover plate with an exhaust pipe formed to the cover plate.SELECTED DRAWING: Figure 5
【課題】基板の変形を修正するための方法及び装置を提供する。【解決手段】基板支持体５００は、基部５０２から上向きに延びている壁５０６によって形成された内部領域を有する基部と、内部領域内に配置された複数の赤外線ランプ５０７と、複数の赤外線ランプの上に配置されて、基板を支持する支持面５１２を含む支持プレート５０８と、支持プレートの上に配置されて、支持面に対応する中心開口部５１４と、カバープレートの頂面の周囲に排気部５１６とを有し、排気部はカバープレートの上の空間とカバープレートに形成された排気導管とを流体連結させる複数の穿孔５２２を有するカバープレート５１０と、を含む。【選択図】図５</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | METHOD OF MODIFYING DEFORMATION OF SUBSTRATE, AND DEVICE |
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