SEMICONDUCTOR DEVICE AND POWER CONVERTER

To provide a technology capable of suppressing creeping-up of a resin sealant.SOLUTION: A semiconductor device includes a container body 1, an electronic component 2 including a semiconductor element mounted on a bottom of the container body 1, one or more external lead terminals 3 drawn upward from...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KAWAHARA FUMIHITO
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a technology capable of suppressing creeping-up of a resin sealant.SOLUTION: A semiconductor device includes a container body 1, an electronic component 2 including a semiconductor element mounted on a bottom of the container body 1, one or more external lead terminals 3 drawn upward from the electronic component 2, a resin sealant 4 disposed in the container body 1 and sealing the electronic component 2. The external lead terminal 3 includes multi-bending number terminals 31 and 32 having two or more bending portions located above an upper surface 4a of the resin sealant 4.SELECTED DRAWING: Figure 1 【課題】樹脂封止剤が這い上がることを抑制可能な技術を提供することを目的とする。【解決手段】半導体装置は、容器体1と、容器体1内の底部上に搭載された半導体素子を含む電子部品2と、電子部品2から上方に引き出された1以上の外部導出端子3と、容器体1内に配設され、電子部品2を封止する樹脂封止剤4とを備える。外部導出端子3は、樹脂封止剤4の上面4aよりも上方に位置する2つ以上の屈曲部を有する多屈曲数端子31,32を含む。【選択図】図1