VAPOR EVAPORATION DEVICE
To provide a vapor evaporation device which reduces difference of a temperature of adjustment object such as a substrate and a vapor evaporation mask from a target temperature.SOLUTION: At least either the substrate W or the vapor evaporation mask M is the adjustment object of temperature, and a res...
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| creator | YANAGIHORI FUMITSUGU YOSHIDA YUICHI |
| description | To provide a vapor evaporation device which reduces difference of a temperature of adjustment object such as a substrate and a vapor evaporation mask from a target temperature.SOLUTION: At least either the substrate W or the vapor evaporation mask M is the adjustment object of temperature, and a resister heating heater 22 for adjusting temperature of the adjustment object by thermally contacting the adjustment object, and a temperature adjustment part 33 for controlling current supplied to the resister heating heater 22 on the basis of a temperature of the adjustment object are provided. A temperature of the adjustment object higher than the temperature of the adjustment object when it is carried into a vacuum tank 16 is a target temperature of the adjustment object. In the temperature adjustment part 33, the target temperature when an evaporation material is discharged from a vapor evaporation source 11 is set to a temperature reached only by supply and its stopping of a heat amount by the resister heating heater 22.SELECTED DRAWING: Figure 1
【課題】基板や蒸着マスクなどの調整対象の温度と目標温度との差異を低減可能とした蒸着装置を提供する。【解決手段】基板Ｗと蒸着マスクＭとの少なくとも一方が温度の調整対象であり、調整対象と熱的に接触して調整対象の温度を調整する抵抗加熱ヒータ２２と、抵抗加熱ヒータ２２に供給する電流を調整対象の温度に基づき制御する温度調整部３３と、を備える。真空槽１６に搬入されたときの調整対象の温度よりも高い調整対象の温度が調整対象の目標温度である。温度調整部３３は、蒸着源１１から蒸着材料が放出されるときの目標温度を、抵抗加熱ヒータ２２による熱量の供給とその停止のみによって到達する温度とする。【選択図】図１ |
| format | Patent |
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【課題】基板や蒸着マスクなどの調整対象の温度と目標温度との差異を低減可能とした蒸着装置を提供する。【解決手段】基板Ｗと蒸着マスクＭとの少なくとも一方が温度の調整対象であり、調整対象と熱的に接触して調整対象の温度を調整する抵抗加熱ヒータ２２と、抵抗加熱ヒータ２２に供給する電流を調整対象の温度に基づき制御する温度調整部３３と、を備える。真空槽１６に搬入されたときの調整対象の温度よりも高い調整対象の温度が調整対象の目標温度である。温度調整部３３は、蒸着源１１から蒸着材料が放出されるときの目標温度を、抵抗加熱ヒータ２２による熱量の供給とその停止のみによって到達する温度とする。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190627&DB=EPODOC&CC=JP&NR=2019104952A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190627&DB=EPODOC&CC=JP&NR=2019104952A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANAGIHORI FUMITSUGU</creatorcontrib><creatorcontrib>YOSHIDA YUICHI</creatorcontrib><title>VAPOR EVAPORATION DEVICE</title><description>To provide a vapor evaporation device which reduces difference of a temperature of adjustment object such as a substrate and a vapor evaporation mask from a target temperature.SOLUTION: At least either the substrate W or the vapor evaporation mask M is the adjustment object of temperature, and a resister heating heater 22 for adjusting temperature of the adjustment object by thermally contacting the adjustment object, and a temperature adjustment part 33 for controlling current supplied to the resister heating heater 22 on the basis of a temperature of the adjustment object are provided. A temperature of the adjustment object higher than the temperature of the adjustment object when it is carried into a vacuum tank 16 is a target temperature of the adjustment object. In the temperature adjustment part 33, the target temperature when an evaporation material is discharged from a vapor evaporation source 11 is set to a temperature reached only by supply and its stopping of a heat amount by the resister heating heater 22.SELECTED DRAWING: Figure 1
【課題】基板や蒸着マスクなどの調整対象の温度と目標温度との差異を低減可能とした蒸着装置を提供する。【解決手段】基板Ｗと蒸着マスクＭとの少なくとも一方が温度の調整対象であり、調整対象と熱的に接触して調整対象の温度を調整する抵抗加熱ヒータ２２と、抵抗加熱ヒータ２２に供給する電流を調整対象の温度に基づき制御する温度調整部３３と、を備える。真空槽１６に搬入されたときの調整対象の温度よりも高い調整対象の温度が調整対象の目標温度である。温度調整部３３は、蒸着源１１から蒸着材料が放出されるときの目標温度を、抵抗加熱ヒータ２２による熱量の供給とその停止のみによって到達する温度とする。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAIcwzwD1JwBVOOIZ7-fgourmGezq48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwNDS0MDE0tTI0ZgoRQA4sCA1</recordid><startdate>20190627</startdate><enddate>20190627</enddate><creator>YANAGIHORI FUMITSUGU</creator><creator>YOSHIDA YUICHI</creator><scope>EVB</scope></search><sort><creationdate>20190627</creationdate><title>VAPOR EVAPORATION DEVICE</title><author>YANAGIHORI FUMITSUGU ; YOSHIDA YUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019104952A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>YANAGIHORI FUMITSUGU</creatorcontrib><creatorcontrib>YOSHIDA YUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANAGIHORI FUMITSUGU</au><au>YOSHIDA YUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VAPOR EVAPORATION DEVICE</title><date>2019-06-27</date><risdate>2019</risdate><abstract>To provide a vapor evaporation device which reduces difference of a temperature of adjustment object such as a substrate and a vapor evaporation mask from a target temperature.SOLUTION: At least either the substrate W or the vapor evaporation mask M is the adjustment object of temperature, and a resister heating heater 22 for adjusting temperature of the adjustment object by thermally contacting the adjustment object, and a temperature adjustment part 33 for controlling current supplied to the resister heating heater 22 on the basis of a temperature of the adjustment object are provided. A temperature of the adjustment object higher than the temperature of the adjustment object when it is carried into a vacuum tank 16 is a target temperature of the adjustment object. In the temperature adjustment part 33, the target temperature when an evaporation material is discharged from a vapor evaporation source 11 is set to a temperature reached only by supply and its stopping of a heat amount by the resister heating heater 22.SELECTED DRAWING: Figure 1
【課題】基板や蒸着マスクなどの調整対象の温度と目標温度との差異を低減可能とした蒸着装置を提供する。【解決手段】基板Ｗと蒸着マスクＭとの少なくとも一方が温度の調整対象であり、調整対象と熱的に接触して調整対象の温度を調整する抵抗加熱ヒータ２２と、抵抗加熱ヒータ２２に供給する電流を調整対象の温度に基づき制御する温度調整部３３と、を備える。真空槽１６に搬入されたときの調整対象の温度よりも高い調整対象の温度が調整対象の目標温度である。温度調整部３３は、蒸着源１１から蒸着材料が放出されるときの目標温度を、抵抗加熱ヒータ２２による熱量の供給とその停止のみによって到達する温度とする。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | VAPOR EVAPORATION DEVICE |
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