VAPOR EVAPORATION DEVICE

To provide a vapor evaporation device which reduces difference of a temperature of adjustment object such as a substrate and a vapor evaporation mask from a target temperature.SOLUTION: At least either the substrate W or the vapor evaporation mask M is the adjustment object of temperature, and a res...

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Hauptverfasser: YANAGIHORI FUMITSUGU, YOSHIDA YUICHI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:To provide a vapor evaporation device which reduces difference of a temperature of adjustment object such as a substrate and a vapor evaporation mask from a target temperature.SOLUTION: At least either the substrate W or the vapor evaporation mask M is the adjustment object of temperature, and a resister heating heater 22 for adjusting temperature of the adjustment object by thermally contacting the adjustment object, and a temperature adjustment part 33 for controlling current supplied to the resister heating heater 22 on the basis of a temperature of the adjustment object are provided. A temperature of the adjustment object higher than the temperature of the adjustment object when it is carried into a vacuum tank 16 is a target temperature of the adjustment object. In the temperature adjustment part 33, the target temperature when an evaporation material is discharged from a vapor evaporation source 11 is set to a temperature reached only by supply and its stopping of a heat amount by the resister heating heater 22.SELECTED DRAWING: Figure 1 【課題】基板や蒸着マスクなどの調整対象の温度と目標温度との差異を低減可能とした蒸着装置を提供する。【解決手段】基板Wと蒸着マスクMとの少なくとも一方が温度の調整対象であり、調整対象と熱的に接触して調整対象の温度を調整する抵抗加熱ヒータ22と、抵抗加熱ヒータ22に供給する電流を調整対象の温度に基づき制御する温度調整部33と、を備える。真空槽16に搬入されたときの調整対象の温度よりも高い調整対象の温度が調整対象の目標温度である。温度調整部33は、蒸着源11から蒸着材料が放出されるときの目標温度を、抵抗加熱ヒータ22による熱量の供給とその停止のみによって到達する温度とする。【選択図】図1