PASTE FOR FORMING RESISTIVE LAYER OF CHIP RESISTOR AND CHIP RESISTOR
To provide a paste for forming a resistive layer for a chip resistor and a chip resistor, which has a resistive layer for which adhesive power is secured to a substrate even when thinned.SOLUTION: A paste for forming a resistive layer of a chip resistor 1000 includes a copper-based alloy powder and...
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| creator | YUN JANG-SEOK |
| description | To provide a paste for forming a resistive layer for a chip resistor and a chip resistor, which has a resistive layer for which adhesive power is secured to a substrate even when thinned.SOLUTION: A paste for forming a resistive layer of a chip resistor 1000 includes a copper-based alloy powder and a nickel powder of more than 0 wt% and 10 wt% or less relative to the copper-based alloy powder and does not include glass. The copper-based alloy preferably contains copper-manganese-tin (Cu-Mn-Sn). A diameter of the nickel powder is preferably 300 nm or less.SELECTED DRAWING: Figure 2
【課題】薄型化されても基板との接着力が確保された抵抗層を有する、チップ抵抗器の抵抗層形成用ペースト、及びチップ抵抗器を提供する。【解決手段】チップ抵抗器１０００の抵抗層形成用ペーストは、銅系合金粉末と、銅系合金粉末対比０ｗｔ％超過１０ｗｔ％以下のニッケル粉末とを含み、ガラスを含まない。銅系合金は、銅−マンガン−錫（Ｃｕ−Ｍｎ−Ｓｎ）を含むことが好ましい。ニッケル粉末の直径は、３００ｎｍ以下であることが好ましい。【選択図】図２ |
| format | Patent |
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【課題】薄型化されても基板との接着力が確保された抵抗層を有する、チップ抵抗器の抵抗層形成用ペースト、及びチップ抵抗器を提供する。【解決手段】チップ抵抗器１０００の抵抗層形成用ペーストは、銅系合金粉末と、銅系合金粉末対比０ｗｔ％超過１０ｗｔ％以下のニッケル粉末とを含み、ガラスを含まない。銅系合金は、銅−マンガン−錫（Ｃｕ−Ｍｎ−Ｓｎ）を含むことが好ましい。ニッケル粉末の直径は、３００ｎｍ以下であることが好ましい。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; RESISTORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190624&DB=EPODOC&CC=JP&NR=2019102795A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190624&DB=EPODOC&CC=JP&NR=2019102795A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUN JANG-SEOK</creatorcontrib><title>PASTE FOR FORMING RESISTIVE LAYER OF CHIP RESISTOR AND CHIP RESISTOR</title><description>To provide a paste for forming a resistive layer for a chip resistor and a chip resistor, which has a resistive layer for which adhesive power is secured to a substrate even when thinned.SOLUTION: A paste for forming a resistive layer of a chip resistor 1000 includes a copper-based alloy powder and a nickel powder of more than 0 wt% and 10 wt% or less relative to the copper-based alloy powder and does not include glass. The copper-based alloy preferably contains copper-manganese-tin (Cu-Mn-Sn). A diameter of the nickel powder is preferably 300 nm or less.SELECTED DRAWING: Figure 2
【課題】薄型化されても基板との接着力が確保された抵抗層を有する、チップ抵抗器の抵抗層形成用ペースト、及びチップ抵抗器を提供する。【解決手段】チップ抵抗器１０００の抵抗層形成用ペーストは、銅系合金粉末と、銅系合金粉末対比０ｗｔ％超過１０ｗｔ％以下のニッケル粉末とを含み、ガラスを含まない。銅系合金は、銅−マンガン−錫（Ｃｕ−Ｍｎ−Ｓｎ）を含むことが好ましい。ニッケル粉末の直径は、３００ｎｍ以下であることが好ましい。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>RESISTORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAJcAwOcVVw8w8CYV9PP3eFINdgz-AQzzBXBR_HSNcgBX83BWcPzwCoOFCho58LqggPA2taYk5xKi-U5mZQcnMNcfbQTS3Ij08tLkhMTs1LLYn3CjAyMLQ0NDAytzR1NCZKEQCuWCw-</recordid><startdate>20190624</startdate><enddate>20190624</enddate><creator>YUN JANG-SEOK</creator><scope>EVB</scope></search><sort><creationdate>20190624</creationdate><title>PASTE FOR FORMING RESISTIVE LAYER OF CHIP RESISTOR AND CHIP RESISTOR</title><author>YUN JANG-SEOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019102795A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>RESISTORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>YUN JANG-SEOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUN JANG-SEOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PASTE FOR FORMING RESISTIVE LAYER OF CHIP RESISTOR AND CHIP RESISTOR</title><date>2019-06-24</date><risdate>2019</risdate><abstract>To provide a paste for forming a resistive layer for a chip resistor and a chip resistor, which has a resistive layer for which adhesive power is secured to a substrate even when thinned.SOLUTION: A paste for forming a resistive layer of a chip resistor 1000 includes a copper-based alloy powder and a nickel powder of more than 0 wt% and 10 wt% or less relative to the copper-based alloy powder and does not include glass. The copper-based alloy preferably contains copper-manganese-tin (Cu-Mn-Sn). A diameter of the nickel powder is preferably 300 nm or less.SELECTED DRAWING: Figure 2
【課題】薄型化されても基板との接着力が確保された抵抗層を有する、チップ抵抗器の抵抗層形成用ペースト、及びチップ抵抗器を提供する。【解決手段】チップ抵抗器１０００の抵抗層形成用ペーストは、銅系合金粉末と、銅系合金粉末対比０ｗｔ％超過１０ｗｔ％以下のニッケル粉末とを含み、ガラスを含まない。銅系合金は、銅−マンガン−錫（Ｃｕ−Ｍｎ−Ｓｎ）を含むことが好ましい。ニッケル粉末の直径は、３００ｎｍ以下であることが好ましい。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS RESISTORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | PASTE FOR FORMING RESISTIVE LAYER OF CHIP RESISTOR AND CHIP RESISTOR |
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