PASTE FOR FORMING RESISTIVE LAYER OF CHIP RESISTOR AND CHIP RESISTOR

To provide a paste for forming a resistive layer for a chip resistor and a chip resistor, which has a resistive layer for which adhesive power is secured to a substrate even when thinned.SOLUTION: A paste for forming a resistive layer of a chip resistor 1000 includes a copper-based alloy powder and a nickel powder of more than 0 wt% and 10 wt% or less relative to the copper-based alloy powder and does not include glass. The copper-based alloy preferably contains copper-manganese-tin (Cu-Mn-Sn). A diameter of the nickel powder is preferably 300 nm or less.SELECTED DRAWING: Figure 2 【課題】薄型化されても基板との接着力が確保された抵抗層を有する、チップ抵抗器の抵抗層形成用ペースト、及びチップ抵抗器を提供する。【解決手段】チップ抵抗器１０００の抵抗層形成用ペーストは、銅系合金粉末と、銅系合金粉末対比０ｗｔ％超過１０ｗｔ％以下のニッケル粉末とを含み、ガラスを含まない。銅系合金は、銅−マンガン−錫（Ｃｕ−Ｍｎ−Ｓｎ）を含むことが好ましい。ニッケル粉末の直径は、３００ｎｍ以下であることが好ましい。【選択図】図２