VACUUM CHUCK STAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

To allow a worker to easily replace only a suction member without touching a vacuum seal member while preventing a decrease in pressure of a suction member for sucking an object.SOLUTION: A base plate 30 in a vacuum chuck stage includes: a first hole (51) formed at a position overlapping a suction member 10 so as to penetrate from an upper surface to a lower surface of the base plate, and vacuum sucking an object (1) to the upper surface of the suction member through the suction member by vacuum drawing; and a second hole (33) formed at a position overlapping the suction member and not overlapping the first hole, and penetrating from the upper surface to the lower surface of the base plate. The suction member is separated from the upper surface of the base plate by inserting a push-up member into the second hole.SELECTED DRAWING: Figure 2 【課題】吸着部材の対象物を吸着する圧力の低下を防止しつつ、作業者が真空シール部材に触れずに吸着部材のみを容易に交換することができる。【解決手段】真空チャックステージにおけるベースプレート３０は、吸着部材１０と重なる位置に形成され、かつ、ベースプレートの上面から下面へ貫通する、真空引きされることで吸着部材を介して吸着部材の上面に対象物（１）を真空吸着するための第１孔（５１）と、吸着部材と重なるとともに第１孔とは重ならない位置に形成され、かつ、ベースプレートの上面から下面へ貫通する第２孔（３３）とを備える。突き上げ部材が第２孔に挿入されることで、吸着部材がベースプレートの上面から離間する。【選択図】図２