PROCESSING METHOD

To prevent a residue of glue on a surface of a plate-like object.SOLUTION: A plate-like object placing step is carried out, in which a rear surface Wb of a wafer W is placed on a holding table 11 having a holding surface 11a larger than the wafer W, and a surface Wa is thereby exposed. After the pla...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WAKAHARA MASATOSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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