MEMS OSCILLATOR
To provide a MEMS oscillator capable of reducing influences of an external stress as much as possible.SOLUTION: A MEMS oscillator comprises: a base 6 that has a housing recessed part 5: an IC chip 3 that includes an oscillation circuit; a MEMS element 2 that includes a MEMS resonator; and a lid 7 th...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide a MEMS oscillator capable of reducing influences of an external stress as much as possible.SOLUTION: A MEMS oscillator comprises: a base 6 that has a housing recessed part 5: an IC chip 3 that includes an oscillation circuit; a MEMS element 2 that includes a MEMS resonator; and a lid 7 that closes an opening of the housing recessed part 5. The housing recessed part 5 in which the IC chip 3 and the MEMS element 2 are housed is sealed by the lid 7 air-tightly. At least an outer peripheral surface of the MEMS element 2 is exposed into a space S formed by bonding of the housing recessed part 5 and the lid 7. The MEMS element 2 is bonded at a decentered position on one surface of the IC chip 3 whose center coincides with a center C1 of the base 6.SELECTED DRAWING: Figure 4
【課題】外部応力の影響を可及的に低減したMEMS発振器を提供する。【解決手段】収納凹部5を有するベース6と、発振回路を含むICチップ3と、MEMS共振子を含むMEMS素子2と、収納凹部5の開口を閉塞するリッド7とを備え、ICチップ3及びMEMS素子2が収納された収納凹部5が、リッド7によって気密に封止され、少なくともMEMS素子2は、その外周面が収納凹部5とリッド7との接合によって形成される空間S内に露出しており、MEMS素子2は、ベース6の中心C1に、その中心が一致したICチップ3の一方の面の偏心した位置に接合されている。【選択図】図4 |
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