WIRING BOARD AND WIRING BOARD FOR MULTIPLE PARTS

To provide a wiring board or the like that has a plurality of surface pads on which electronic components are to be mounted subsequently to the first main surface of the board body and has improved mountability of an electronic component by suppressing variation in thickness of a plated layer coated on the surface of each of the surface pads.SOLUTION: A wiring board 1a includes a board body 2 that is constituted by insulating materials s1 and s2 and has a first main surface 3 and a second main surface 4 opposite to each other with a rectangular outline in plan view, and four side surfaces 5 located between the main surfaces 3 and 4, two surface pads 6a and 6b formed on the main surface 3, and a plurality of inner layer wirings 7a to 7c, 8a, 8b, 8p, 9a, and 9b formed inside the board body 2, and the inner layer wirings 7a to 7c, and the like have ends 8ae, 8be, 9ae, and 9be on different side surfaces 5 of the board body 2, and two sets of conductive circuits C1 and C2 are formed by two of the inner layer wirings 7a to 7c and the like and the two surface pads 6a and 6b, are electrically isolated from each other, and the conductive circuits C1 and C2 are connected to the inner layer wirings 7a to 7c, and the like through one of the surface pad 6a and 6b.SELECTED DRAWING: Figure 1 【課題】基板本体の第１の主面に追って電子部品が実装される複数の表面パッドを有し、該表面パッドごとの表面に被覆されるメッキ層相互の厚みのばらつきを抑制することで、電子部品の実装性を向上させた配線基板等を提供する。【解決手段】絶縁材ｓ１，ｓ２からなり、平面視の外形が矩形で対向する第１の主面３及び第２の主面４、並びに該主面３，４間に位置する四辺の側面５を有する基板本体２と、その主面３に形成された２個の表面パッド６ａ，６ｂと、基板本体２の内部に形成された複数の内層配線７ａ〜７ｃ，８ａ，８ｂ，８ｐ，９ａ，９ｂとを備え、内層配線７ａ〜７ｃ等は、基板本体２の異なる側面５に端部８ａｅ，８ｂｅ，９ａｅ，９ｂｅを有し、２つの内層配線７ａ〜７ｃ等と２個の表面パッド６ａ，６ｂとにより２組の通電回路Ｃ１，Ｃ２を形成し、両者は、互いに電気的に独立しており、通電回路Ｃ１，Ｃ２は、１つの表面パッド６ａ，６ｂを通過して内層配線７ａ〜７ｃ等と接続されている、配線基板１ａ。【選択図】 図１