ELECTRONIC COMPONENT

To provide a compact electronic component in which the resistance is decreased between a terminal and a via electric wiring.SOLUTION: An electronic component 100 has multiple dielectric layers 11a-e composed of ceramic material, multiple conductor patterns 12b-e constituting at least a part of a circuit element, and multiple terminals 14 provided on the outer surface of the outermost dielectric layer, out of the multiple dielectric layers, including multiple conductor layers 14a, b, where the conductor layer in contact with the outer surface contains a metallic substance and an insulator material. The electronic component includes via wirings 13b-d penetrating the dielectric layers, other than the outermost dielectric layer out of the multiple dielectric layers, and electrically connecting at least two conductor patterns out of the multiple conductor patterns, and a via wiring 15 penetrating the outermost dielectric layer, electrically connecting at least one terminal with at least one conductor pattern, out of the multiple conductor patterns, and in which the first contact area in contact with the at least one terminal is larger than the cross sectional area in parallel with the outer surface of the via wiring.SELECTED DRAWING: Figure 3 【課題】端子とビア配線との間を低抵抗化し、小型化した電子部品を提供する。【解決手段】電子部品１００は、セラミック材料からなる複数の誘電体層１１ａ〜ｅと、回路素子の少なくとも一部を構成する複数の導電体パターン１２ｂ〜ｅと、複数の誘電体層のうち最も外側の誘電体層の外側の面に設けられ、複数の導電体層１４ａ、ｂを含み、外側の面に接する導電体層は金属材料と絶縁体材料とを含む複数の端子１４とを有する。複数の誘電体層のうち最も外側の誘電体層以外の誘電体層を貫通し、複数の導電体パターンのうち少なくとも２つの導電体パターン間を電気的に接続するビア配線１３ｂ〜ｄと、最も外側の誘電体層を貫通し、少なくとも１つの端子と複数の導電体パターンのうち少なくとも１つの導電体パターンとを電気的に接続し、少なくとも１つの端子と接触する第１接触面積が前記ビア配線の外側の面に平行な断面積より大きいビア配線１５と、を備える。【選択図】図３