RELEASE FILM FOR EPOXY RESIN-CONTAINING LAYER TRANSFER FILM AND EPOXY RESIN-CONTAINING LAYER TRANSFER FILM

To provide a release film for epoxy resin-containing layer transfer film which simultaneously satisfies both good releasability after hot press and suppression of failure occurrence such as contact fault of a precision electric apparatus, and an epoxy resin-containing layer transfer film.SOLUTION: A...

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Bibliographische Detailangaben
Hauptverfasser:	SUGIYAMA RYUICHI, NAKAGAKI TAKAMITSU, TSUJIUCHI NAOKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a release film for epoxy resin-containing layer transfer film which simultaneously satisfies both good releasability after hot press and suppression of failure occurrence such as contact fault of a precision electric apparatus, and an epoxy resin-containing layer transfer film.SOLUTION: A release film is used for a transfer film on which an epoxy resin-containing layer is laminated, and has a release layer formed of a composition (I) or a composition (II) on a base material film. Composition (I): composition containing a compound (a) containing an alkyl group having 8 or more carbon atoms and a crosslinking agent (b). Composition (II): a composition containing a compound (α) containing an alkyl group having 8 or more carbon atoms and an ethylenic unsaturated group.SELECTED DRAWING: None 【課題】熱プレス後の剥離性が良好であること、および精密電子機器の接点障害等の不具合発生を抑制することを同時に満足する、エポキシ樹脂含有層転写フィルム用離型フィルム、およびエポキシ樹脂含有層転写フィルムを提供する。【解決手段】エポキシ樹脂含有層が積層された転写フィルムに用いられる離型フィルムであって、基材フィルム上に、組成物（Ｉ）または組成物（ＩＩ）からなる離型層を備えた、エポキシ樹脂含有層転写フィルム用離型フィルム。組成物（Ｉ）；炭素数８以上のアルキル基を含む化合物（ａ）および架橋剤（ｂ）を含有する組成物組成物（ＩＩ）；炭素数８以上のアルキル基とエチレン性不飽和基とを含む化合物（α）を含有する組成物【選択図】なし