HEAD MODULE FOR 3D PRINTER, 3D PRINTER AND MOLDING METHOD

To provide a head module capable of suppressing temperature rise for preventing a molding material from softening at a supply port of a molding material supply part even when a molding material has a melting temperature of 300°C or over.SOLUTION: The head module contains: a heating head 2 for heating a molding material 92a flowing in a discharge head 1 and a thermal conduction suppression component (barrel 61, thermal insulation spacer 3) which is directly or indirectly connected with the discharge head 1 and contains a molding material supply opening 61a, 3a for supplying a molding material 91 to a discharge part 12; wherein the thermal conduction suppression component (barrel 61, thermal insulation spacer 3) is formed from a material having a thermal conductivity of 5 W/(m °C) or under, preferably, 3 W/(m °C) or under.SELECTED DRAWING: Figure 1A 【課題】造形材料が３００℃以上の融解温度を有する場合でも、造形材料供給部の供給口で、造形材料が軟化しないように温度上昇を抑制する。【解決手段】吐出ヘッド１内を流動させる造形材料９２ａを加熱する加熱ヘッド２と、吐出ヘッド１に、直接的、または間接的に接続され、吐出部１２に造形材料９１を供給するための造形材料供給孔６１ａ、３ａを有する熱伝導抑制部材（バレル６１、断熱スペーサ３）を備えており、熱伝導抑制部材（バレル６１、断熱スペーサ３）が、５Ｗ／（ｍ・℃）以下、好ましくは３Ｗ／（ｍ・℃）以下の熱伝導率の材料で形成されている。【選択図】図１Ａ