PRESSURE-SENSITIVE ADHESIVE TAPE FOR DICING AND DICING/DIE BONDING INTEGRATED TAPE

To provide a dicing/die bonding integrated tape capable of achieving both of the severability of a semiconductor wafer and the pick up property of a semiconductor chip at a sufficiently high level in a semiconductor device manufacturing process including stealth dicing.SOLUTION: The dicing/die bondi...

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Bibliographische Detailangaben
Hauptverfasser:	OKUBO KEISUKE, KIMURA HISAHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide a dicing/die bonding integrated tape capable of achieving both of the severability of a semiconductor wafer and the pick up property of a semiconductor chip at a sufficiently high level in a semiconductor device manufacturing process including stealth dicing.SOLUTION: The dicing/die bonding integrated tape according to the present invention comprises: a base material layer; a pressure-sensitive adhesive layer; and an adhesive layer, in this order. The pressure-sensitive adhesive layer includes a (meth) acrylic resin, a photopolymerization initiator, and a crosslinking agent. The dicing/die bonding integrated tape before being cured by ultraviolet irradiation, has a storage elastic modulus at -15°C of 40 MPa or more, and after being subjected to curing treatment by ultraviolet irradiation, the dicing/die bonding integrated tape has a storage elastic modulus at 25°C of 100 MPa or more.SELECTED DRAWING: Figure 1 【課題】ステルスダイシングを含む半導体装置の製造プロセスにおいて、半導体ウエハの分断性及び半導体チップのピックアップ性の両方を十分に高水準に達成できるダイシングダイボンディング一体型テープを提供する。【解決手段】本発明に係るダイシングダイボンディング一体型テープは、基材層と、粘着剤層と、接着剤層とをこの順序で備える。上記粘着剤層は、（メタ）アクリル系樹脂と、光重合開始剤と、架橋剤とを含むとともに、紫外線照射による硬化処理前において、−１５℃における貯蔵弾性率が４０ＭＰａ以上であり、かつ、紫外線照射による硬化処理後において、２５℃における貯蔵弾性率が１００ＭＰａ以上である。【選択図】図１