METHOD FOR MANUFACTURING SUBSTRATE

To provide a method for manufacturing a substrate, capable of preventing a protective film from being peeled during shape processing and easily peeling the protective film after the shape processing.SOLUTION: The method for manufacturing a substrate comprises: the attaching step of attaching a prote...

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Bibliographische Detailangaben
Hauptverfasser:	KASHIWABARA YASUHIRO, NAGAO TAKUYA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	To provide a method for manufacturing a substrate, capable of preventing a protective film from being peeled during shape processing and easily peeling the protective film after the shape processing.SOLUTION: The method for manufacturing a substrate comprises: the attaching step of attaching a protective film having a non-adhesive region at a position facing a central portion of each substrate and having an adhesive region at a position facing an edge portion of each substrate so as to surround the non-adhesive region on a base material; the shape processing step of processing a predetermined shape in the base material having the attached protective film; the preliminary peeling step of forming a cut line in the non-adhesive region of the protective film; and the peeling step of peeling the protective film from the substrate by using the cut line as a starting point and peeling the protective film from a central portion of each substrate toward the outside.SELECTED DRAWING: Figure 4 【課題】形状加工処理中における保護フィルムの剥離を防止し、かつ、形状加工処理後に保護フィルムを剥離し易くすることが可能な基板製造方法を提供する。【解決手段】基板製造方法は、各基板の中央部に対向すべき位置に非粘着領域を有し、かつ、この非粘着領域を囲むように各基板の縁部に対向すべき位置に粘着領域を有する保護フィルムを、母材に貼付する貼付ステップと、保護フィルムが貼付された母材に対して所定の形状加工処理を行う形状加工処理ステップと、形状加工処理ステップ後に、保護フィルムの被粘着領域に切れ目を入れる予備剥離ステップと、切れ目を始点として保護フィルムを各基板の中央部から外側に向かって剥離することにより、この保護フィルムを基板から剥離する剥離ステップと、を含む。【選択図】図４