SHIELDING IN ELECTRONIC ASSEMBLIES

To provide arrangements for shielding electronic assemblies, and methods and devices that can implement taller electronic components.SOLUTION: An electronic assembly 100 includes a circuit board 102 having a first face 116 and a second opposing face 118, and a shield 120 coupled to the second face o...

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Bibliographische Detailangaben
Hauptverfasser:	SCOTT MOKLER, BYRD KEVIN, TIMOTHY SWETTLEN
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To provide arrangements for shielding electronic assemblies, and methods and devices that can implement taller electronic components.SOLUTION: An electronic assembly 100 includes a circuit board 102 having a first face 116 and a second opposing face 118, and a shield 120 coupled to the second face of the circuit board. The circuit board has a hole 112 extending therethrough, and the shield extends into the hole toward the first face.SELECTED DRAWING: Figure 1A 【課題】エレクトロニクスアセンブリを遮蔽するための構成と、更に背の高い電子部品の実装が可能な方法及び装置を提供する。【解決手段】エレクトロニクスアセンブリ１００は、第１の面１１６及び反対側の第２の面１１８を有する回路ボード１０２と、該回路ボードの第２の面に結合されたシールド１２０とを含む。回路ボードが、それを貫いて延在する孔１１２を有するとともに、シールドが、第１の面に向かって該孔の中まで延在する。【選択図】図１Ａ