SILVER POWDER MIXTURE, MANUFACTURING METHOD THEREFOR, AND CONDUCTIVE PASTE

To provide a silver powder mixture suitable for forming a conductive membrane on a surface of a member with elasticity, a manufacturing method therefor, and a conductive paste using the silver powder mixture.SOLUTION: By adding a reductant consisting of one or more kinds of L-ascorbic acid, erythorb...

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Hauptverfasser: SASAKI GENTA, OKANO TAKU, SAITO YU, MOGI NORIO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:To provide a silver powder mixture suitable for forming a conductive membrane on a surface of a member with elasticity, a manufacturing method therefor, and a conductive paste using the silver powder mixture.SOLUTION: By adding a reductant consisting of one or more kinds of L-ascorbic acid, erythorbic acid, and a salt thereof after maintaining a solution in which one or two kind of a salt of copper and aluminum, and ethylene diamine tetraacetic acid to a silver nitrate solution for 60 sec., a silver powder mixture in which a filamentous silver powder consisting of a spherical part and a filamentous part, and a flake shaped silver powder having average particle diameter of 1 μm to 50 μm, and an aspect ratio defined as a ratio between average longer diameter and average thickness of 1.5 or more are mixed at a prescribed ratio.SELECTED DRAWING: Figure 1 【課題】伸縮性を有する部材の表面に導電膜を形成するのに適した銀粉混合物およびその製造法並びにその銀粉混合物を用いた導電性ペーストを提供する。【解決手段】硝酸銀水溶液に銅およびアルミニウムの塩の1種または2種とエチレンジアミン四酢酸塩を添加した溶液を60秒以上保持した後、L−アスコルビン酸、エリソルビン酸およびそれらの塩の1種または2種以上からなる還元剤を添加することにより、球状部と糸状部とからなる糸状銀粉と平均粒径が1μm以上50μm以下であり、かつ、平均長径と平均厚みの比として定義されるアスペクト比が1.5以上のフレーク状銀粉とが所定の割合で混合された銀粉混合物が得られる。【選択図】図1