EPOXY RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT
To provide an epoxy resin excellent in low hygroscopicity, heat resistance, flexibility, solvent solubility, and dielectric properties.SOLUTION: A terminal diglycidyl compound is an epoxy resin with an epoxy equivalent of 200-50,000 g/equiv., where the epoxy resin has an alkylene glycol chain having...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | To provide an epoxy resin excellent in low hygroscopicity, heat resistance, flexibility, solvent solubility, and dielectric properties.SOLUTION: A terminal diglycidyl compound is an epoxy resin with an epoxy equivalent of 200-50,000 g/equiv., where the epoxy resin has an alkylene glycol chain having up to 30 of repeating units, having two benzene rings or alkylene ethers. Bonds of the benzene ring comprise a direct bond, a C1-13 divalent hydrocarbon group, -O-, -S-, -SO-, -C(CF)- or -CO-, and comprise a C2-20 divalent hydrocarbon group.SELECTED DRAWING: None
【課題】低吸湿性、耐熱性、可撓性、溶剤溶解性、誘電特性に優れたエポキシ樹脂を提供する。【解決手段】エポキシ当量が200〜50,000g/当量のエポキシ樹脂であり、該エポキシ樹脂が、2個のベンゼン環を含むか、又はアルキレンエーテルを含む、30迄の操り返し単位からなるアルキレングリコール鎖を有する、末端ジグラシジル化合物。前記ベンゼン環の結合が、直接結合、炭素数1〜13の2価の炭化水素基、−O−、−S−、−SO2−、−C(CF3)2−又は−CO−からなる、及び炭素数2〜20の2価の炭化水素基からなる、エポキシ樹脂。【選択図】なし |
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