METHOD OF MANUFACTURING PROCESSING SUBSTRATE

To provide a method of manufacturing a processing substrate from which a film can be easily peeled, even when using a film with high adhesion for substrate surface protection.SOLUTION: There is provided a method of manufacturing a processing substrate 11 with a protective film 13 attached to the substrate 11 for performing predetermined processing, the method including: an attachment step of placing a paper piece 12 made of non-adhesive or low-adhesive material in a center of a surface of the substrate 11, and attaching the protective film 13 via an edge of the surface of the substrate 11 so as to sandwich the paper piece 12; a processing step of performing predetermined processing on the substrate 11 to which the protective film 13 is attached; a preliminary peeling step of, after the processing step, making a slit 14 in the opposing area of the film 13 and the paper piece 12; and a peeling step of peeling the protective film 13 away from the center of the substrate 11 toward the edge starting from an end 15 of the slit 14.SELECTED DRAWING: Figure 1 【課題】基板表面保護に、粘着力の大きいフィルムを用いる場合であっても、容易にフィルムを剥離できる、処理基板の製造方法を提供する。【解決手段】基板１１に保護フィルム１３を貼着して所定の処理を行う処理基板１１の製造方法であって、基板１１表面の中央部に非粘着または低粘着材質からなる紙片１２を載置し、紙片１２を挟み込むように基板１１表面の縁部を介して保護フィルム１３を貼着する貼着工程と、保護フィルム１３を貼着された基板１１に対して所定の処理を行う処理工程と、処理工程の後に、上記フィルム１３と上記紙片１２との対向領域に切れ込み１４を入れる予備剥離工程と、切れ込み１４の端部１５を起点として基板１１の中央部から縁部に向かって保護フィルム１３を引き離す剥離工程と、を含む処理基板１１の製造方法。【選択図】図１