TIN ELECTROPLATING OR TIN-ALLOY PLATING SOLUTION, AND PRODUCTION METHOD OF TIN OR TIN-ALLOY PLATED MATERIAL

To provide Sn or Sn-alloy plating solution in which low concentration Pb can be realized.SOLUTION: Sn electroplating or Sn-alloy plating solution for forming a plated material to be provided for solder joint comprises at least: a sulfur-based compound; an Sn salt; one or more acids or water-soluble...

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Hauptverfasser:	ENOMOTO MASATO, KANO TOSHIKAZU, TSUJIMOTO MASANORI, KISO MASAYUKI, OKADA TOORU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	To provide Sn or Sn-alloy plating solution in which low concentration Pb can be realized.SOLUTION: Sn electroplating or Sn-alloy plating solution for forming a plated material to be provided for solder joint comprises at least: a sulfur-based compound; an Sn salt; one or more acids or water-soluble salts of them that are selected from among inorganic acids, organic acids, and the water-soluble salts of them; and a surfactant. The sulfur-based compound is a thiol compound (formula A), a thiol compound (formula A) salt, or a disulfide compound (formula B), which is expressed in one of following general formulae.SELECTED DRAWING: None 【課題】低濃度Ｐｂ化に可能なＳｎ又はＳｎ合金めっき液を提供することを目的とする。【解決手段】はんだ接合に供されるめっき物形成のための電解Ｓｎ又はＳｎ合金めっき液であって、少なくとも、硫黄系化合物と、Ｓｎ塩と、無機酸、有機酸又その水溶性塩から選ばれる１種以上の酸又はその水溶性塩と、界面活性剤とを含有し、前記硫黄系化合物は、下記の一般式であらわされるチオール化合物（式Ａ）、チオール化合物（式Ａ）の塩、又はジスルフィド化合物（式Ｂ）であることを特徴とする電解Ｓｎ又はＳｎ合金めっき液。【選択図】なし