SEMICONDUCTOR DEVICE

To provide a semiconductor device in which stress applied to bumps between a mounting substrate and a semiconductor package is reduced to achieve high reliability.SOLUTION: A semiconductor device according to the present embodiment comprises: a package substrate having a first surface and a second s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANIMOTO AKIRA, NUMATA NAOKO, MUKODA HIDEKO, MIYAWAKI KENJI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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