PUMP DEVICE, PROCESS LIQUID SUPPLY DEVICE, SUBSTRATE PROCESSING DEVICE, LIQUID DISCHARGE METHOD, AND LIQUID REPLACEMENT METHOD

To provide a pump device capable of easily discharging liquid inside a chamber, a process liquid supply device, a substrate processing device, a liquid discharge method and a liquid replacement method.SOLUTION: A first opening 55A, a second opening 55B and a third opening 55C that are at least three...

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Bibliographische Detailangaben
Hauptverfasser:	NISHIMURA ATSUKI, OGURA HIROYUKI, KADOMA TORU, KIRITA MASASHI, KASHIWAYAMA MASATO, SAGAWA EIJU, YOSHIDA SHOGO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PERFORMING OPERATIONS POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	To provide a pump device capable of easily discharging liquid inside a chamber, a process liquid supply device, a substrate processing device, a liquid discharge method and a liquid replacement method.SOLUTION: A first opening 55A, a second opening 55B and a third opening 55C that are at least three openings communicating with a storage part 48 are formed in a chamber 33. The second opening 55B is positioned higher than the first opening 55A. The third opening 55C introduces gas from the first opening 55A into the storage part 48, such that the third opening 55C is used for discharging liquid inside the storage part 48 by introducing the gas from at least any one of the other two openings 55A and 55B into the storage part 48. The third opening 55C is located at the lowest position among the three openings 55A-55C, such that the liquid stored in the storage part 48 can be easily discharged.SELECTED DRAWING: Figure 1 【課題】チャンバ内の液体を容易に抜くことができるポンプ装置、処理液供給装置、基板処理装置、液抜き方法および液置換方法を提供する。【解決手段】チャンバ３３には、貯留部４８に連通する少なくとも３つの開口である第１開口５５Ａ、第２開口５５Ｂ、第３開口５５Ｃが形成されている。第２開口５５Ｂは、第１開口５５Ａよりも高い位置にある。第３開口５５Ｃは、第１開口５５Ａから貯留部４８内に気体が導入されることにより、第３開口５５Ｃは、他の２つの開口５５Ａ，５５Ｂの中で少なくともいずれか１つの開口から貯留部４８内に気体が導入されることにより、貯留部４８内の液体を排出するために用いられる。第３開口５５Ｃは、３つの開口５５Ａ〜５５Ｃの中で最も低い位置にあるので、貯留部４８に収容される液体を容易に抜くことができる。【選択図】図１