PUMP UNIT AND SUBSTRATE TREATMENT APPARATUS

PUMP UNIT AND SUBSTRATE TREATMENT APPARATUS

To provide a pump unit capable of adjusting accurately a discharge amount of liquid; and to provide a substrate treatment apparatus.SOLUTION: A pump unit includes a pump room, a piston, a motor and a control unit. The control unit specifies a virtual end point r with reference to a discharge command...

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Bibliographische Detailangaben
Hauptverfasser: NISHIMURA ATSUKI, KADOMA TORU, OGURA HIROYUKI, KIRITA MASASHI, KASHIWAYAMA MASATO, YOSHIDA SHOGO, TAKEUCHI HIROYUKI, YAMAMOTO SATOSHI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS
PUMPS
PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
SEMICONDUCTOR DEVICES
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
WEAPONS
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Beschreibung
Zusammenfassung:To provide a pump unit capable of adjusting accurately a discharge amount of liquid; and to provide a substrate treatment apparatus.SOLUTION: A pump unit includes a pump room, a piston, a motor and a control unit. The control unit specifies a virtual end point r with reference to a discharge command, theory information A, and a present position Q of the piston 25. The control unit corrects the virtual end point r to a target position R with reference to a correction graph Bg. The control unit outputs, to the motor, a drive command for moving the piston 25 from a departure position Q to the target position R.SELECTED DRAWING: Figure 5 【課題】液体を吐き出す量を精度良く調整できるポンプ装置および基板処理装置を提供する。【解決手段】ポンプ装置は、ポンプ室とピストンとモータと制御部を備える。制御部は、吐き出し命令と理論情報Ａとピストン２５の現在位置Ｑを参照して、仮想終点ｒを特定する。制御部は、補正グラフＢｇを参照して、仮想終点ｒを目標位置Ｒに補正する。制御部は、ピストン２５を出発位置Ｑから目標位置Ｒに移動させる駆動命令をモータに出力する。【選択図】図５