THERMALLY CONDUCTIVE COMPOSITION AND SEMICONDUCTOR DEVICE

To provide a thermally conductive composition capable of obtaining high thermal conductivity.SOLUTION: A thermally conductive composition 100 contains a first metal powder 10, a second metal powder 20, and a binder 3. The first metal powder 10 contains a plurality of first metal particles 1. The ave...

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Bibliographische Detailangaben
Hauptverfasser:	KOMATSU KEIICHI, WASHIO TEPPEI, YAMAGUCHI ATSUSHI, NISHITANI SEIJI, JIN JIN, YAMAMOTO HIROSHI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	To provide a thermally conductive composition capable of obtaining high thermal conductivity.SOLUTION: A thermally conductive composition 100 contains a first metal powder 10, a second metal powder 20, and a binder 3. The first metal powder 10 contains a plurality of first metal particles 1. The average particle diameter of the first metal powder 10 is within the range of more than 1 μm and 5 μm or less. The second metal powder 20 contains a plurality of second metal particles 2. Each of the plurality of second metal particles 2 has a core 22 and a coat layer 23 coating the core 22. The average particle diameter of the second metal powder 20 is larger than that of the first metal powder 10.SELECTED DRAWING: Figure 1 【課題】高熱伝導性を得ることができる熱伝導性組成物を提供する。【解決手段】第１金属粉１０と、第２金属粉２０と、バインダ３と、を含有する熱伝導性組成物１００である。第１金属粉１０は、複数の第１金属粒子１を含む。第１金属粉１０の平均粒子径は、１μｍ超５μｍ以下の範囲内である。第２金属粉２０は、複数の第２金属粒子２を含む。複数の第２金属粒子２の各々は、コア２２と、コア２２を被覆するコート層２３と、を有する。第２金属粉２０の平均粒子径は、第１金属粉１０の平均粒子径よりも大きい。【選択図】図１