DICING TAPE AND DICING DIE-BONDING FILM
To provide a dicing tape and a dicing die-bonding film (DDAF, Dicing Die attach film), which are suitable for widening the clearance between DAF-attached semiconductor chips on a dicing tape while suppressing the float-up of the chips from a dicing tape after dicing in an expanding step which is to...
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| creator | MIZOBATA KAORI ONISHI KENJI SUGIMURA TOSHIMASA TAKAMOTO HISAHIDE AKAZAWA MITSUHARU KOSAKA NAOFUMI KIMURA TAKEHIRO TSURUSAWA TOSHIHIRO |
| description | To provide a dicing tape and a dicing die-bonding film (DDAF, Dicing Die attach film), which are suitable for widening the clearance between DAF-attached semiconductor chips on a dicing tape while suppressing the float-up of the chips from a dicing tape after dicing in an expanding step which is to be performed with a DDAF for obtaining die-bonding film(DAF)-attached semiconductor chips, and suitable for realizing satisfactory easiness of pickup in a pick-up step.SOLUTION: As to a dicing tape 10 of the present invention, the ratio of a tensile stress caused at a distortion value of 20% in a tensile test (a test pieces of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 1000 mm/minute to a tensile stress caused at a distortion value of 20% in a tensile test (a test piece of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 10 mm/minute is 1.4 or more. A DDAF of the invention comprises: the dicing tape 10; and a DAF 20 on its sticker layer 12.SELECTED DRAWING: Figure 1
【課題】ダイボンドフィルム（ＤＡＦ）付き半導体チップを得るためにダイシングダイボンドフィルム（ＤＤＡＦ）を使用して行うエキスパンド工程にてダイシングテープ上の割断後のＤＡＦ付き半導体チップにつきダイシングテープからの浮きを抑制しつつ離間距離を広げるのに適するとともに、ピックアップ工程にて良好なピックアップ性を実現するのに適した、ダイシングテープ及びＤＤＡＦを、提供する。【解決手段】本発明のダイシングテープ１０は、引張速度１０ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力に対する、引張速度１０００ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力の比の値が、１.４以上である。本発明のＤＤＡＦは、ダイシングテープ１０とその粘着剤層１２上のＤＡＦ２０とを含む。【選択図】図１ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2019016634A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2019016634A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2019016634A3</originalsourceid><addsrcrecordid>eNrjZFB38XT29HNXCHEMcFVw9HNRgPJdPF11nfz9XEBsN08fXx4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgaGlgaGZmbOJoTJQiAOZKI6M</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DICING TAPE AND DICING DIE-BONDING FILM</title><source>esp@cenet</source><creator>MIZOBATA KAORI ; ONISHI KENJI ; SUGIMURA TOSHIMASA ; TAKAMOTO HISAHIDE ; AKAZAWA MITSUHARU ; KOSAKA NAOFUMI ; KIMURA TAKEHIRO ; TSURUSAWA TOSHIHIRO</creator><creatorcontrib>MIZOBATA KAORI ; ONISHI KENJI ; SUGIMURA TOSHIMASA ; TAKAMOTO HISAHIDE ; AKAZAWA MITSUHARU ; KOSAKA NAOFUMI ; KIMURA TAKEHIRO ; TSURUSAWA TOSHIHIRO</creatorcontrib><description>To provide a dicing tape and a dicing die-bonding film (DDAF, Dicing Die attach film), which are suitable for widening the clearance between DAF-attached semiconductor chips on a dicing tape while suppressing the float-up of the chips from a dicing tape after dicing in an expanding step which is to be performed with a DDAF for obtaining die-bonding film(DAF)-attached semiconductor chips, and suitable for realizing satisfactory easiness of pickup in a pick-up step.SOLUTION: As to a dicing tape 10 of the present invention, the ratio of a tensile stress caused at a distortion value of 20% in a tensile test (a test pieces of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 1000 mm/minute to a tensile stress caused at a distortion value of 20% in a tensile test (a test piece of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 10 mm/minute is 1.4 or more. A DDAF of the invention comprises: the dicing tape 10; and a DAF 20 on its sticker layer 12.SELECTED DRAWING: Figure 1
【課題】ダイボンドフィルム（ＤＡＦ）付き半導体チップを得るためにダイシングダイボンドフィルム（ＤＤＡＦ）を使用して行うエキスパンド工程にてダイシングテープ上の割断後のＤＡＦ付き半導体チップにつきダイシングテープからの浮きを抑制しつつ離間距離を広げるのに適するとともに、ピックアップ工程にて良好なピックアップ性を実現するのに適した、ダイシングテープ及びＤＤＡＦを、提供する。【解決手段】本発明のダイシングテープ１０は、引張速度１０ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力に対する、引張速度１０００ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力の比の値が、１.４以上である。本発明のＤＤＡＦは、ダイシングテープ１０とその粘着剤層１２上のＤＡＦ２０とを含む。【選択図】図１</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190131&DB=EPODOC&CC=JP&NR=2019016634A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190131&DB=EPODOC&CC=JP&NR=2019016634A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIZOBATA KAORI</creatorcontrib><creatorcontrib>ONISHI KENJI</creatorcontrib><creatorcontrib>SUGIMURA TOSHIMASA</creatorcontrib><creatorcontrib>TAKAMOTO HISAHIDE</creatorcontrib><creatorcontrib>AKAZAWA MITSUHARU</creatorcontrib><creatorcontrib>KOSAKA NAOFUMI</creatorcontrib><creatorcontrib>KIMURA TAKEHIRO</creatorcontrib><creatorcontrib>TSURUSAWA TOSHIHIRO</creatorcontrib><title>DICING TAPE AND DICING DIE-BONDING FILM</title><description>To provide a dicing tape and a dicing die-bonding film (DDAF, Dicing Die attach film), which are suitable for widening the clearance between DAF-attached semiconductor chips on a dicing tape while suppressing the float-up of the chips from a dicing tape after dicing in an expanding step which is to be performed with a DDAF for obtaining die-bonding film(DAF)-attached semiconductor chips, and suitable for realizing satisfactory easiness of pickup in a pick-up step.SOLUTION: As to a dicing tape 10 of the present invention, the ratio of a tensile stress caused at a distortion value of 20% in a tensile test (a test pieces of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 1000 mm/minute to a tensile stress caused at a distortion value of 20% in a tensile test (a test piece of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 10 mm/minute is 1.4 or more. A DDAF of the invention comprises: the dicing tape 10; and a DAF 20 on its sticker layer 12.SELECTED DRAWING: Figure 1
【課題】ダイボンドフィルム（ＤＡＦ）付き半導体チップを得るためにダイシングダイボンドフィルム（ＤＤＡＦ）を使用して行うエキスパンド工程にてダイシングテープ上の割断後のＤＡＦ付き半導体チップにつきダイシングテープからの浮きを抑制しつつ離間距離を広げるのに適するとともに、ピックアップ工程にて良好なピックアップ性を実現するのに適した、ダイシングテープ及びＤＤＡＦを、提供する。【解決手段】本発明のダイシングテープ１０は、引張速度１０ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力に対する、引張速度１０００ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力の比の値が、１.４以上である。本発明のＤＤＡＦは、ダイシングテープ１０とその粘着剤層１２上のＤＡＦ２０とを含む。【選択図】図１</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB38XT29HNXCHEMcFVw9HNRgPJdPF11nfz9XEBsN08fXx4G1rTEnOJUXijNzaDk5hri7KGbWpAfn1pckJicmpdaEu8VYGRgaGlgaGZmbOJoTJQiAOZKI6M</recordid><startdate>20190131</startdate><enddate>20190131</enddate><creator>MIZOBATA KAORI</creator><creator>ONISHI KENJI</creator><creator>SUGIMURA TOSHIMASA</creator><creator>TAKAMOTO HISAHIDE</creator><creator>AKAZAWA MITSUHARU</creator><creator>KOSAKA NAOFUMI</creator><creator>KIMURA TAKEHIRO</creator><creator>TSURUSAWA TOSHIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20190131</creationdate><title>DICING TAPE AND DICING DIE-BONDING FILM</title><author>MIZOBATA KAORI ; ONISHI KENJI ; SUGIMURA TOSHIMASA ; TAKAMOTO HISAHIDE ; AKAZAWA MITSUHARU ; KOSAKA NAOFUMI ; KIMURA TAKEHIRO ; TSURUSAWA TOSHIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2019016634A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2019</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MIZOBATA KAORI</creatorcontrib><creatorcontrib>ONISHI KENJI</creatorcontrib><creatorcontrib>SUGIMURA TOSHIMASA</creatorcontrib><creatorcontrib>TAKAMOTO HISAHIDE</creatorcontrib><creatorcontrib>AKAZAWA MITSUHARU</creatorcontrib><creatorcontrib>KOSAKA NAOFUMI</creatorcontrib><creatorcontrib>KIMURA TAKEHIRO</creatorcontrib><creatorcontrib>TSURUSAWA TOSHIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIZOBATA KAORI</au><au>ONISHI KENJI</au><au>SUGIMURA TOSHIMASA</au><au>TAKAMOTO HISAHIDE</au><au>AKAZAWA MITSUHARU</au><au>KOSAKA NAOFUMI</au><au>KIMURA TAKEHIRO</au><au>TSURUSAWA TOSHIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DICING TAPE AND DICING DIE-BONDING FILM</title><date>2019-01-31</date><risdate>2019</risdate><abstract>To provide a dicing tape and a dicing die-bonding film (DDAF, Dicing Die attach film), which are suitable for widening the clearance between DAF-attached semiconductor chips on a dicing tape while suppressing the float-up of the chips from a dicing tape after dicing in an expanding step which is to be performed with a DDAF for obtaining die-bonding film(DAF)-attached semiconductor chips, and suitable for realizing satisfactory easiness of pickup in a pick-up step.SOLUTION: As to a dicing tape 10 of the present invention, the ratio of a tensile stress caused at a distortion value of 20% in a tensile test (a test pieces of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 1000 mm/minute to a tensile stress caused at a distortion value of 20% in a tensile test (a test piece of 20 mm in width, an initial inter-chuck distance of 100 mm, 23°C) with a tensile speed of 10 mm/minute is 1.4 or more. A DDAF of the invention comprises: the dicing tape 10; and a DAF 20 on its sticker layer 12.SELECTED DRAWING: Figure 1
【課題】ダイボンドフィルム（ＤＡＦ）付き半導体チップを得るためにダイシングダイボンドフィルム（ＤＤＡＦ）を使用して行うエキスパンド工程にてダイシングテープ上の割断後のＤＡＦ付き半導体チップにつきダイシングテープからの浮きを抑制しつつ離間距離を広げるのに適するとともに、ピックアップ工程にて良好なピックアップ性を実現するのに適した、ダイシングテープ及びＤＤＡＦを、提供する。【解決手段】本発明のダイシングテープ１０は、引張速度１０ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力に対する、引張速度１０００ｍｍ／分での引張試験（試験片幅２０ｍｍ，初期チャック間距離１００ｍｍ，２３℃）にて歪み値２０％で生ずる引張応力の比の値が、１.４以上である。本発明のＤＤＡＦは、ダイシングテープ１０とその粘着剤層１２上のＤＡＦ２０とを含む。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | DICING TAPE AND DICING DIE-BONDING FILM |
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