THERMOCOMPRESSION BONDING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

To provide a thermocompression bonding apparatus capable of satisfactorily thermocompressing a plurality of thermocompression-bonding scheduled portions at the same time, and a manufacturing method of an electronic component including a step of thermocompression bonding using the thermocompression b...

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Bibliographische Detailangaben

1. Verfasser:	SATO TAKATERU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
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